Technology Committees


Tinplate & Electrogalvanizing Technology Committee

MISSION: To define and refine the key processes for electroplated steel strip through the exchange of experiences, education and technologies to advance the industry.


AIST Staff Engineer
Ken Landau
+1.724.814.3036

Chair
Dwain R. Hultberg, Jr.
Ohio Coatings Co.

Vice Chair
Gary J. Lombardo
MacDermid Inc.

Upcoming Meetings

AIST Tinplate & Electrogalvanizing Technology Committee Meeting

Date: 07 May 2014    Location: Indiana Convention Center, Indianapolis, Indiana
Contact: Ken Landau +1.724.814.3036    

Committee Activities

Stay involved by viewing current and past Tinplate & Electrogalvanizing Technology Committee (TETC) meeting and event activities.  

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Members Only

Visit the Tinplate & Electrogalvanizing TC members only area to access meeting minutes, presentations, rosters and listservers.

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