Technology Committees


Tinplate & Electrogalvanizing Technology Committee Activities

The Tinplate & Electrogalvanizing Technology Committee (TETC) met on 3–4 October 2012 with 25 attendees. The meeting began with a bus tour of Ohio Coatings in Yorkville, Ohio, followed by a tour of CMI in Salem, Ohio. Gary Lombardo of MacDermid Inc. welcomed the attendees. Joe Sullivan of U. S. Steel – Gary Works led a discussion on safety. Sullivan credited ideas learned from other producers at past TETC meetings as being a key element in the improvement of his department’s safety record. Representatives from producer companies presented their company’s program for new employee training, on-the-job pre-planning risk recognition and corrective action procedures and tracking. Jacko Pijper of Magneto Special Anodes presented, “Insoluble Anodes.” The remainder of the meeting was spent in a roundtable discussion moderated by C.J. Wu of United States Steel Corporation, which focused on root causes and elimination of tin dust, smut and haze in the tinning process. The next TETC meeting is scheduled for 15–16 January 2013 in Concord, Calif., with USS-POSCO hosting the tour. This will be a joint meeting with the Rolls Technology Committee.   

The Tinplate & Electrogalvanizing Technology Committee (TETC) met at AISTech in Atlanta, Ga., on 9 May 2012. The attendees agreed that the North American continuous sheet electroplating market has matured and seems to have a “harvesting” mentality: there have been few investments in new technologies or expansion within North America. North American producers are focused on maximizing productivity with existing equipment by sustaining knowledge and sharing best practices as needed between them. Gary Lombardo and the attendees agreed that, to remain vital and relevant, the TETC must adapt to the tinplate/electrogalvanizing markets’ increasingly global trend. The committee will investigate the idea of an international electroplating forum for fall 2013. The initial framework of this forum would be a three-day event: one day each for themes related to plating, rolling/annealing and a facility tour. The TETC would promote this event through AIST’s international channels and networking within its members.
The TETC leadership for 2012–2013 is: Dwain Hultberg of Ohio Coating, chair; Gary Lombardo of MacDermid, vice chair; C.J. Wu of United States Steel Corporation, papers chair; Andrew Procopio of Inductotherm, membership chair; and Eric Almquist of Star Tool and Die, programs chair. The next TETC meeting will be 3–4 October 2012 and will include a tour of Ohio Coatings. The Metallurgy of Tinmill Practices Subcommittee of the TETC met 9 May 2012 in Phoenix, Ariz. The progress of the revision to ASTM A630 was discussed. A couple questions need to be clarified before the final precision statement can be issued. The next subcommittee meeting will be 14 November 2012 in Atlanta, Ga., to coordinate with the ASTM A01.20 committee meetings.

The Tinplate & Electrogalvanizing Technology Committee (TETC) met 7–8 March 2012 in Merrillville, Ind. Joe Sullivan of U. S. Steel – Gary Works opened the meeting by welcoming everyone and stressed that the purpose of the meeting is to share information and to mentor younger committee members. Eric Almquist of Star Tool and Die volunteered to take the meeting minutes. The AIST Antitrust Guidelines were reviewed and all in attendance agreed to abide by them. The meeting minutes from the 4–5 October 2011 meeting in Concord, Calif., which included a tour of USS-Posco Industries, were reviewed and approved as written. The Tinplate & Electrogalvanizing AISTech 2013 Call for Papers topic was approved as: “Advancements applicable to tin mill and electrogalvanizing processes. Topics of particular interest include (but are not limited to): process improvements, process control, new or emerging technologies, procedures/practices, process reliability, quality control, water treatment, energy conservation, recycling and other environmental opportunities.” Dave Psenicska and Dominick Gaudio from MacDermid presented, “Rolling Oil Lubrication Theory and Practice.” Brian O’Leary of Danline presented, “Bristle Brush Strip Cleaning.” Sullivan then hosted a tour of the U. S. Steel – Gary Works’ tin mill. The following day started with a roundtable discussion on safety, with comments and suggestions from each of the mills represented. The discussions then progressed to rolling mill topics, which included: warming cold mill rolls, vision systems, strip center tearouts, dark spots, coolant, tramp oil, water spots, strip temperature control and the use of iron rolls. Further discussions followed, with topics including: strip breaks, tensionmeter systems, furnace tubes and furnace purging/restarting practices. A short discussion related to latest updates/news on the hexavalent chromium passivation mitigation timeline followed. The TETC met on 9 May 2012 at AISTech 2012 in Atlanta, Ga. Ohio Coatings volunteered to host the next TETC meeting on 3–4 October 2012.          

The Tinplate & Electrogalvanizing Technology Committee (TETC) met 4–5 October 2011 in Concord, Calif., with 34 attendees. Joe Sullivan of U. S. Steel – Gary Works opened the meeting by welcoming everyone to California and asking the attendees to introduce themselves. Ronnie Pierce of USS-POSCO Industries presented a brief overview of their facility and reviewed the safety requirements for the tour. The attendees then went on a very informative tour of the USS-POSCO facility. After the group returned to the meeting room, Eric Almquist of Star Tool & Die volunteered to take the meeting minutes. The AIST Antitrust Guidelines were reviewed, and all in attendance agreed to abide by them. The minutes from the 3 May 2011 TETC meeting were reviewed and approved as written. A safety roundtable took place, with each of the attending producers referring to a formatted questionnaire that was circulated prior to the meeting. Non-producing attendees were encouraged to participate in the roundtable according to their experience in different facilities. Electrometals USA gave a presentation entitled, “Tin Reclamation and Anode Production,” and Global Gauge Corp. gave a presentation entitled, “Coating Weight Gauging.” A question and answer session followed each presentation. The second day was dedicated to the Producer Only Subcommittee, during which roundtable discussions on quality and operations were held. The next TETC meeting is scheduled for 7–8 March 2012, with a plant tour hosted by RG Steel Sparrows Point.

The Tinplate & Electrogalvaning Technology Committee (TETC) met on 3 May 2011 during AISTech in Indianapolis, Ind. John Young of ArcelorMittal welcomed everyone to the meeting with a special thanks to the producers. Eric Almquist of Star Tool and Die volunteered to take the meeting minutes. Mr. Young reviewed the AIST Antitrust Guidelines and everyone agreed to abide by them. The minutes from the 5–6 April 2011 meeting were reviewed and approved as written. Some current safety concerns and anecdotes were discussed. The committee elected officers: Joseph Sullivan of U. S. Steel – Gary Works, chair; Gary Lombardo of MacDermid, vice chair; C.J. Wu, Metallurgy Subcommittee chair, Producers Only chair and papers chair; and Mr. Almquist is the Meeting Plawnning Subcommittee chair. The TETC mission statement was reviewed and left unchanged to read: “Defining and refining the key processes for electroplated steel strip through the exchange of experiences, education and technologies to advance the industry.” The next meeting is being planned for early October 2011 in Pittsburg, Calif., with a tour of USS-POSCO.

The Tinplate & Electrogalvanizing Technology Committee (TETC) met on 5–6 April 2011 in Merrillville, Ind. The committee chair, John Young of ArcelorMittal, welcomed everyone to the meeting and thanked them for attending. Eric Almquist of Star Tool & Die Works Inc. volunteered to take the meeting minutes. Mr. Young reviewed the AIST Antitrust Guidelines and all the attendees agreed to abide by them. All of the attendees introduced themselves and gave a brief description of their responsibilities. The minutes from the 5–6 October 2010 meeting in Coraopolis, Pa., were reviewed and approved as written. Mr. Young provided an overview of the Producer Only Subcommittee session that was conducted prior to the full committee meeting. The discussions involved box annealing, secondary rolling and a benchmarking questionnaire. Wynn Kearns of CMI-EFCO gave a presentation entitled, “Life and Maintenance of Tinplate CAL Radiant Tubes,” and Ed Schaming of Schaming Innovations gave a presentation entitled “Optimizing Roll Alignment and Roll Nip Uniformity.” The committee discussed the format for future meetings, providing a number of suggestions to make the meeting even more beneficial to the attendees. United States Steel Corporation hosted a tour of their Midwest tin mill, for which the group was very grateful. Please visit AIST.org for additional information on TETC activities.

The Tinplate & Electrogalvanizing Technology Committee (TETC) met near the Pittsburgh airport on Oct. 5–6. The meeting began with a Producer-Only Subcommittee meeting, which C.J. Wu of U. S. Steel opened by welcoming everyone in attendance. The AIST Anti-Trust Guidelines were reviewed and agreed to by the meeting attendees. Eight production facilities represented by five steel companies participated in this second TETC Producer-Only Subcommittee meeting. All participating facilities shared their own safety performance/practices, incidents/accidents, and exchanged creative ideas for better communication. All participants completed a survey regarding electroplating of tin and chromium processes (equipment and practices), and the results were shared and discussed. The suggestion was made to have each tin mill host the full TETC and Producer-Only Subcommittee meeting. The Producer-Only portion of the meeting adjourned at noon for lunch. The full TETC met after lunch, with John Young of ArcelorMittal opening the meeting. Eric Almquist of Star Tool and Die volunteered to take the meeting minutes. The minutes from the previous meeting were reviewed and approved as written. Frank Goodwin from the International Lead Zinc Research Organization reviewed the selection of abstracts for AISTech 2011, and the TETC agreed with his recommendations. Dr. Goodwin also spoke about the upcoming MS&T’10 conference in Houston, Texas, including papers to be presented during the event. Presentations were given on the topic of electrolyte technologies: “Overview of Vertical and Horizontal Plating Technologies” by C.J. Wu, “Highly Suppressive Additives for MSA and Sulfuric Acid Electrolytes” by Peter Levey of Dow Chemical, “Comparison Overview of Tinplate Electrolytes” by Gary Lombardo, and “Sulfate-Based Electrolyte” by Rob Schetty of Technic. A panel discussion followed the presentations. The following day, Glenn Bush of Bush and Associates facilitated an open discussion related to topics that were ranked by committee members via an Internet survey. Despite a low response percentage, the topical ranking was verified as appropriate by the attendees. Key topics were: Conductor Roll Coatings, Preventive Maintenance, General Operating Problems, Solution Control, Tin Dust, Line Stops, pH Measurement, Control of Product Quality, Roll Changes, Strip Tracking, On-Line Analysis, and On-Line Inspection. It should be noted that the attendees expressed satisfaction with the format. Mr. Almquist explained his role as current program planning subcommittee chair, and submitted a request for new subcommittee members. Gary Lombardo of McDermid, Bill Donovan of U. S. Steel, Mike Dauw of Dow Chemical, and Jeff Wetzel of MacDermid kindly volunteered. The venue for the spring 2011 TETC meeting is not yet finalized. ArcelorMittal Weirton hosted a tour of their facility, which included all of the mills currently in operation there.

The Tinplate & Electrogalvaning Technology Committee (TETC) met on 4 May, 2010, during AISTech in Pittsburgh, Pa. Dr. C.J. Wu of U. S. Steel welcomed everyone to the meeting and explained a brief history of the challenges that have faced the two-year-old TETC since its creation. Eric Almquist of Star Tool and Die volunteered to take the meeting minutes. Dr. Wu reviewed the AIST Anti-Trust Guidelines, and everyone agreed to abide by them. A safety discussion took place. Dr. Frank Goodwin of the International Zinc Association presented an overview of AISTech papers, highlighting the drought of TETC-focused papers. He challenged the committee to help develop papers for AISTech 2011. This led to discussion related to fostering and promoting the TETC. Dr. Stavros Fountoulakis of ArcelorMittal noted the lack of other forums for tinning organizations, and that this is an opportunity to promote the TETC. He explained that metal packaging organizations exist and have an organizational presence for the tin/EG industry, but they don’t focus so much on steel e-coating production processes. Dr. Fountoulakis recommended sending letters to critical contacts to promote the existence of the TETC. The committee chose their new officers as: John Young of ArcelorMittal Weirton as chair, Dr. Wu as vice chair, Dr. Goodwin as papers chair, Mr. Almquist as Meeting Planning Subcommittee chair, Dave Tancibok of Severstal Sparrows Point as the Metallurgy of Tin Plate Subcommittee chair, and Dr. Wu as Producer-Only Subcommittee chair. The TETC mission was reviewed and left unchanged: “Defining and refining the key processes for electroplated steel strip through the exchange of experiences, education and technologies to advance the industry.” The next TETC meeting is planned for Oct. 5–6, 2010, near the Pittsburgh airport, with a tour of the ArcelorMittal Weirton tin mill facility.

The Tinplate & Electrogalvanizing Technology Committee (TETC) met on Tuesday, 5 May in St. Louis, Mo., in conjunction with AISTech 2009. The committee chair, Eric Almquist of Star Tool and Die, opened the meeting by asking the attendees to introduce themselves. Mr. Almquist provided a brief overview of the meeting minutes from the TETC teleconference meeting held on April 28. The meeting minutes were approved by the committee as written. The TETC then elected its leadership for the 2009–2010 term. C.J. Wu of United States Steel Corporation was chosen as the committee chair. John Young of ArcelorMittal Weirton was elected as vice chair. The committee mission statement was reviewed and left as is: “Defining and refining the key processes for electroplated steel strip through the exchange of experiences, education, and technologies to advance the industry.” The committee agreed to develop a Membership Subcommittee to focus on reaching, polling and attracting those who enthusiastically participated in the AISI and ASF committees to attain that “critical mass” of grass-roots enthusiasm from the producers. Mr. Almquist was presented with a plaque to commemorate his service as 2008–2009 TETC chair by Frank Goodwin, former committee chair. The next TETC meeting is scheduled for Sept. 29–30, 2009, and will include a plant tour of the ArcelorMittal Weirton tin mill.